Publication - Journal Article Investigation of Die Stress Profiles During Powder Compaction Using Instrumented Die

https://doi.org/10.1007/s11665-008-9229-1
Journal Article
Journal of Materials Engineering and Performance, vol. 17, iss. 3, pp. 382-386, 2008
Authors
Sung-Tae Hong, Yuri Hovanski, Curt A. Lavender, K. Scott Weil
English