Publication - Journal Article Use of electrodeposition for sample preparation and rejection rate prediction for assay of electroformed ultra high purity copper for 232Th and 238U prior to inductively coupled plasma mass spectrometry (ICP/MS)

https://doi.org/10.1007/s10967-008-0716-5

Journal Article

Journal of Radioanalytical and Nuclear Chemistry, vol. 277, iss. 1, pp. 103-110, 2008

Authors

E. W. Hoppe, C. E. Aalseth, R. Brodzinski, A. R. Day, O. T. Farmer, T. W. Hossbach, J. I. McIntyre, H. S. Miley, E. E. Mintzer, A. Seifert, J. E. Smart, G. A. Warren

Language English

Publication - Journal Article Use of electrodeposition for sample preparation and rejection rate prediction for assay of electroformed ultra high purity copper for 232Th and 238U prior to inductively coupled plasma mass spectrometry (ICP/MS)

DOI