Publication - Journal Article Evaluation of intermetallic compound layer at aluminum/steel interface joined by friction stir scribe technology DOI https://doi.org/10.1016/j.matdes.2019.107795 Journal Article Materials & Design, vol. 174, pp. 107795, 2019 Authors Tianhao Wang, Harpreet Sidhar, Rajiv S. Mishra, Yuri Hovanski, Piyush Upadhyay, Blair Carlson Language English
