Stretchable Mold Interconnect Optimization: Peeling Automation and Carrierless Techniques

Journal Article
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, iss. 5, pp. 955-962, 2019
Authors
Bart Plovie, Yang Yang, Sheila Dunphy, Kristof Dhaenens, Steven Van Put, Frederick Bossuyt, Jan Vanfleteren
English