Publication - Journal Article Highly Densified Cu Wirings Fabricated from Air‐Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility DOI https://doi.org/10.1002/admi.201800798 Journal Article Advanced Materials Interfaces, vol. 5, iss. 19, pp. 1800798, 2018 Authors Wanli Li, Yang Yang, Bowen Zhang, Cai‐Fu Li, Jinting Jiu, Katsuaki Suganuma Language English
