Mechanistic Studies on the Insertion of Carbonyl Substrates into Cu‐H: Different Rate‐Limiting Steps as a Function of Electrophilicity

Journal Article
Angewandte Chemie International Edition, vol. 59, iss. 22, pp. 8645-8653, 2020
Authors
Ba L. Tran, Benjamin D. Neisen, Amy L. Speelman, Thilina Gunasekara, Eric S. Wiedner, R. Morris Bullock
English