Publication - Journal Article Thermosonic flip-chip bonding system with a self-planarization feature using polymer DOI https://doi.org/10.1109/6040.784501 Journal Article IEEE Transactions on Advanced Packaging, vol. 22, iss. 3, pp. 468-475, 1999 Authors Qing Tan, B. Schaible, L.J. Bond, Yung-Cheng Lee Language English
