Accelerating the insertion reactions of (NHC)Cu–H via remote ligand functionalization

Journal Article
Chemical Science, vol. 12, iss. 34, pp. 11495-11505, 2021
Authors
Amy L. Speelman, Ba L. Tran, Jeremy D. Erickson, Monica Vasiliu, David A. Dixon, R. Morris Bullock
Abstract
Remote modification of an N-heterocyclic carbene ligand with bulky or electron-rich groups in [(NHC)Cu(μ-H)]2 increases the rate of substrate insertion, which kinetics studies suggest arises from changes in the Cu–H monomer–dimer equilibrium.
English